Method and device for three-dimensional arrangement of wire and method of manufacturing conductive material

ABSTRACT

A method and apparatus ( 10 ) are used for manufacturing a wire structure wherein a wire ( 13 ) is three-dimensionally aligned at prescribed pitches. The method comprises the steps of providing one or more frame bodies ( 12 ) which have a prescribed thickness, peripherally of a rotary shaft ( 11 ). By rotating rotary shaft ( 11 ) about a rotation axis thereof, wires ( 13 ) are wound, at prescribed pitches, around frame bodies ( 12 ). Another frame body ( 12 ) is stacked on at least one existing frame body and wire ( 13 ) is wound thereon at prescribed pitches. The above steps are repeated to yield a wire structure having a wire aligned three-dimensionally and accurately at prescribed pitches.

TECHNICAL FIELD

The present invention relates to a method of three-dimensional wirealignment and an apparatus therefor for manufacturing a wire structurewherein the wire is aligned three-dimensionally at prescribed pitches,and also to a method of manufacturing electrically conductive materialssuch as printed circuit board materials or anisotropic conductivematerials using the wire structure.

BACKGROUND ART

Manufacturing wire structures wherein electrically conductive wires arealigned three dimensionally and accurately at prescribed pitches is animportant technology for manufacturing an anisotropic conductivematerial comprising a wire structure embedded into rubber or resins.Anisotropic conductive materials are used as members for printed circuitboard materials or the like wherein the electrodes on a device and on adistributing board are connected facing with respect to each other. Inthis case, electricity is conducted only between electrodes along thewires, and is insulated in the direction horizontally of the device orthe distributing board. By taking advantage of such characteristics,anisotropic conductive materials have been widely used as wiring membersfor calculators, liquid crystal devices, and so on.

The printed circuit board includes a slot for receiving an integratedcircuit and a group of connecting terminals for variety of electroniccomponents on one side, and a printed conductive path for connectingcomponents on the other side, which has been traditionally used inquantity as a constituent member for electronic equipment.

Conventionally, materials used for printed circuit boards have beenmanufactured by the steps of manufacturing a plate body made ofinsulating materials such as epoxy resin or glass, forming a throughhole for conduction of electricity at a prescribed location by drillingoperation, coating the through hole for conduction of electricity with aconductive metal such as copper by means of plating operation, and thensealing the through hole with a sealing agent.

However, there are recognized disadvantages in that drilling on theplate body produces chips during the process, which may lead to productdefects, and that plating is subject to cracks at the edge portion ofthe board material, which may lead to faulty conductivity. In addition,the ratio of the length of the through hole (thickness of the board) tothe diameter of the hole is limited to about 5 for drilling, andtherefore, the lower limit of diameters of through holes for boards of 1mm in thickness will be about 0.2 mm. However, smaller diameters arepreferable for obtaining a printed circuit board of high densities,which has been difficult to obtain by drilling.

A circuit board manufactured using the steps of inserting electricwires, such as Ni or Co, into a frame body, pouring an insulatingmaterial such as molten epoxy resin or the like therein, cutting italong a plane perpendicular to the metal wires after the resin ishardened, and connecting both cut planes electrically is presented (seeJapanese Unexamined Patent Application Publication No. 49-8759).

However, since an epoxy resin or the like is used in this circuit board,there has been a disadvantage in that accuracy in dimension such as apitch of the through holes may be impaired due to volumetric shrinkageof about 2 to 3% in the process of the curing of the resin. This is aserious disadvantage since accuracy in dimension is a very importantfactor in a high-density printed circuit board.

In addition, in this type of circuit board, a difference of the thermalexpansion between the circuit board material and conductive layerslaminated on one or both sides thereof (photo process layer) is notconsidered, and thus, separation between board materials and conductivelayers may occur due to the impact applied during service or temperaturevariations. Separation may also occur between an insulating material andthe metal wires.

In view of above described disadvantages of the prior art, it is anobject of the present invention to provide a method of three-dimensionalwire alignment and an apparatus used therefor that enables manufacturingof large size wire structures as well as miniature wire structureswherein a wire is aligned three-dimensionally accurately at prescribedpitches, and that ensures high productivity and facility of handling.

It is another object of the present invention to provide a method ofmanufacturing conductive materials such as a printed circuit boardmaterial or an anisotropic conductive material wherein satisfactoryelectrical conductivity is established and the thermal expansionproperty may be controlled so that separation between a board materialand a conductive layer, and between an insulating material and ametallic line (wire) during service can be prevented.

It is still another object of the present invention to provide a methodof manufacturing conductive materials that enables the realization of aprinted circuit board material or an anisotropic conductive materialwith higher density and improved dimensional accuracy conveniently andeasily with improved workability.

SUMMARY OF THE INVENTION

According to the present invention, there is provided a first method formanufacturing a wire structure having a wire aligned three-dimensionallyat prescribed pitches comprising the steps of disposing one or moreframe bodies, which have a prescribed thickness, peripherally of arotary shaft. Winding wires on the frame bodies at prescribed pitches insuch a manner that the wire contacts at least one surface of the framebodies by rotating the rotary shaft; and repeating steps of stackinganother frame body on the above described frame bodies and winding wiresthereon at prescribed pitches.

According to the present invention, there is also provided a secondmethod for manufacturing a wire structure having a wire alignedthree-dimensionally at prescribed pitches comprising the steps ofdisposing two separator plates, each having a prescribed thickness, atpositions parallel to and spaced from a rotation axis of a rotary shaft.The wires are wound on the separator plates at prescribed pitches byrotating the rotary shaft about the rotation axis; and repeating stepsof stacking subsequent sets of separator plates on the above describedtwo separator plates and winding wires thereon at prescribed pitches.

According to the present invention, there is further provided a thirdmethod for manufacturing wire structures having wires alignedthree-dimensionally at prescribed pitches comprising the steps ofbuilding a mold, either by disposing one or more frame bodies having aprescribed thickness on the periphery of the mold or by disposing twoseparator plates having a prescribed thickness on any one or two sidesof the periphery of the mold, keeping a prescribed distance apart fromone another. The wires are wound at prescribed pitches on the abovedescribed frame bodies or the separator plates building the mold bymoving a wire bobbin around the mold, and repeating steps of stackingsubsequent sets of frame bodies or separator plates on the abovedescribed frame bodies or the separator plates and winding a wirethereon at prescribed pitches.

According to the present invention, there is also provided a firstapparatus for three-dimensional wire alignment comprising two sideplates spaced apart and facing one another disposed along a directionperpendicular to a rotation axis of a rotary shaft defined therein. Twoseparator plates each having a prescribed thickness, are disposed atpositions parallel to and spaced from the rotation axis. The apparatusalso includes a driving means for rotating the side plates and separatorplates about the rotation axis; and a wire bobbin for feeding a wire tobe wound thereon at prescribed pitches from the side of the outerperiphery of the two separator plates.

Preferably, in the above described method and apparatus forthree-dimensional wire alignment, V-shaped grooves are formed on an endsurface of the separator plates at prescribed pitches for aligning wirethree-dimensionally and accurately.

According to the present invention, there is provided a second apparatusfor three-dimensional wire alignment comprising a wire feedingmechanism, a spacer and a guide block for straining a wire, a mold forfixing the spacer and the guide block, and a rotary mechanism forrotating the mold. Groove portions for disposing the wire on the spacerare formed at prescribed pitches and prescribed depths, and guide blocksare provided with notched portions, at prescribed pitches, for definingthe position of the wire and supporting the tensile strength of thewire.

Preferably, this apparatus for three-dimensional wire alignment isconstructed in such a manner that as the spacers and the guide blocksare subsequently stacked, the distance between the spacer and thenotches formed on the guide blocks becomes larger. It is also preferablethat the apparatus is constructed in such a manner that the wire isstrained between a plurality of groove portions positioned on animaginary line extending almost straightly parallel with the stackingdirection of the spacers and notched portions formed on the guide blockwhen the spacers are stacked in the prescribed multiple layers.

It is also preferable that the guide block is provided with a bevelportion corresponding to the straining angle of the wire. The bevelportion prevents contact between the wire strained from the guide blockand portions of the guide block other than the notched portions. It isfurther preferable to form the bottom portion of the notched portion ina profile having an obtuse angle or a curvature because it can preventthe wire from being broken due to extreme bending thereof.

When straining a wire, it is preferable to use a wire feeding mechanismthat can control the wire feeding position by sliding itself in adirection parallel to the rotary shaft of the rotary mechanism, andtherefore, a plurality of wires may be fed to the mold at one time. Inorder to achieve high productivity, it is preferred to use a mold havinga symmetric structure about the rotary shaft of the rotary mechanism.

According to the present invention, there is provided a method formanufacturing a wire structure wherein the wire is strainedthree-dimensionally at prescribed pitches between groove portions and atpitches of the thickness of a spacer comprising steps of: using a wirefeeding mechanism; a spacer provided with grooves formed at prescribedpitches and at prescribed depths for straining the wire by arranging itat prescribed pitches; a guide block provided with notched portionsformed at prescribed pitches for defining the straining position of thewire and supporting the tensile strength of the wire; a mold formounting the spacer and the guide block; and a rotary mechanism forrotating the mold; rotating the mold while adjusting the feedingposition of the wire from the wire feeding mechanism so that the wire isreceived in the prescribed notched portions and the groove portions; andstacking the spacers and the guide blocks on the mold while suspendingthe rotation of the mold instantaneously.

Preferably, the guide block is disposed in such a manner so as to lessenthe stress that is due to the tensile strength of the wire applied tothe edge portion of the spacer to prevent the deformation of the spacerso that the accuracy of the position where the spacers are stacked isensured.

According to the present invention, there is further provided a methodfor manufacturing a conductive material comprising the steps of: pouringan insulating material into a wire structure obtained by any one of theabove described first to third methods of three-dimensional wirealignment or method of manufacturing the wire structure; curing theinsulating material, and slicing the cured insulating material along theplanes traversing the wire.

Preferably, the insulating material is any one of rubber, plastic, orplastic-ceramics composites.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic block diagram of the apparatus for implementing amethod of three-dimensional wire alignment (first method of alignment)of one embodiment according to the present invention.

FIG. 2 is a side view of the apparatus shown in FIG. 1.

FIG. 3 is a perspective view illustrating one example of a frame body inaccordance with the present invention.

FIG. 4 is a perspective view illustrating one example of a wirestructure in accordance with the present invention.

FIG. 5 is a schematic block diagram illustrating one embodiment of amethod of three-dimensional wire alignment (second method of alignment)and an apparatus for three-dimensional wire alignment (first apparatusof alignment) for implementing the same according to the presentinvention.

FIG. 6 is an explanatory drawing illustrating an example of a separatorplate in accordance with the present invention.

FIG. 7 is an explanatory drawing illustrating another embodiment of anapparatus for three-dimensional wire alignment (second apparatus ofalignment) according to the present invention.

FIG. 8 is a plan view of the wire feeding mechanism shown in FIG. 7viewed from the top of FIG. 7.

FIG. 9 is an explanatory drawing illustrating a structure of a moldingused for the apparatus of wire alignment shown in FIG. 7.

FIGS. 10 (a),(b),(c),(d) are explanatory drawings illustrating oneembodiment of a guide block structure used for the apparatus forthree-dimensional wire alignment shown in FIG. 7. FIG. 10(a) is a rearelevation, FIG. 10(b) is a plan view, FIG. 10(c) is a front view and anenlarged view of the notched portion, and FIG. 10(d) is across-sectional view.

FIG. 11 is a perspective view illustrating one embodiment of the spacerused for the apparatus for three-dimensional wire alignment shown inFIG. 7.

FIG. 12 is an explanatory drawing illustrating the state of the wirestrained between multiple layers of spacers and a guide block in theapparatus for three-dimensional wire alignment shown in FIG. 7.

FIG. 13 is a cross-sectional view illustrating the state of spacer beingstacked in the apparatus for three-dimensional wire alignment shown inFIG. 7.

FIG. 14 is a partially perspective view illustrating one example of thecomposite block body manufactured according to the method ofmanufacturing a conductive material of the present invention.

FIG. 15 is a perspective view illustrating one example of the printedcircuit board material obtained by the method of manufacturing aconductive material according to the present invention.

FIG. 16 is a perspective view illustrating an example of the printedcircuit board.

DETAILED DESCRIPTION OF THE INVENTION

The method of three-dimensional wire alignment according to the presentinvention may be generally classified into the following three methods:

1. A method of alignment comprising the steps of: disposing a frame body(flame shaped spacer) peripherally of a rotary shaft; winding a wire onthe frame body by rotating the rotary shaft; repeating steps of stackinganother frame body onto the above described frame bodies; and winding awire again thereon.

2. A method of alignment comprising the steps of: disposing separatorplates at positions parallel to and spaced apart from one another andparallel to and spaced apart from a rotation axis of a rotary shaft,winding a wire on the separator plates by rotating the rotary shaftabout the rotation axis; repeating steps of stacking subsequent sets ofseparator plates on the above described separator plates and winding awire again thereon.

3. A method of alignment in contrast to the above described first andsecond methods comprising the steps of: building a mold by disposing aframe body (frame shaped spacer) or separator plates; fixing the mold;winding a wire on the frame body or separator plates by moving a wirebobbin around the mold; and repeating steps of stacking subsequent setsof frame bodies or separator plates on the above described frame bodiesor separator plates and winding a wire again thereon.

The present invention will be now described in detail according toembodiments, however, it is to be understood that the invention is notlimited to the specific embodiments thereof.

FIG. 1 is a schematic block diagram illustrating one embodiment of theapparatus for implementing the method of three-dimensional wirealignment according to the present invention, and FIG. 2 is a side viewof the apparatus shown in FIG. 1.

The apparatus for three-dimensional wire alignment 10 comprises a rotaryshaft 11 and four frame bodies (frame shaped spacers) disposedperipherally of the rotary shaft. The frame body 12 has a shape as shownin FIG. 3 and has a thickness corresponding to the pitch of wire 13 tobe wound. On these four frame bodies 12 disposed peripherally of rotaryshaft 11, wire 13 fed from wire bobbin 14 may be wound. When startingwinding, wire 13 is fixed at the fixing portion (not shown) provided inthe vicinity of the apparatus for three-dimensional wire alignment 10.Reference numeral 15 represents a base for supporting rotary shaft 11and frame bodies 12 as well as four wire bobbins 14 via arm 16.

The wire 13 fed from wire bobbin 14 is wound on frame body 12 generallyvia a guide or the like which is not shown at prescribed pitches.

In the apparatus for three-dimensional wire alignment 10 having aconstruction shown above, wire 13 may be wound on frame body 12 byrotating rotary shaft 11 one turn by means of a motor, which is notshown, synchronized with the rotation of wire bobbin 14. Then subsequentsets of frame bodies 12 are stacked on existing frame bodies 12, and awire 13 is wound on subsequent sets of frame bodies 12. These steps arerepeated.

In this embodiment, since the apparatus comprising four frame bodies 12disposed peripherally of rotary shaft 11 so that the cross-section takenalong the axis is square in shape, the rotation of rotary shaft 11 isproceeded by 90°, and each time rotary shaft 11 rotates by 90°, steps ofstacking frame bodies 12 and winding of wire 13 thereon are carried out.As a matter of course, the number of the frame bodies 12 peripherally ofrotary shaft 11 are not limited to four, for example, there could beonly one. However, it is preferable to dispose four frame bodies,because the cross-section taken along the axis will have the geometry ofa square so that the wire structure may be manufactured throughefficient use of the periphery of rotary shaft 11.

In this way, by repeating steps of stacking another frame body 12thereon after every rotation of rotary shaft 11, and winding a wire 13thereon at prescribed pitches, a wire structure having wire 13 alignedat prescribed pitches accurately and three-dimensionally may beobtained.

According to the steps described above, four wire structures as shown inFIG. 4 are obtained. After manufacturing four wire structures 17, thewire portions extending between each wire structure 17 are cut to removeeach wire structure 17 from the periphery of rotary shaft 11, and fourframe bodies 12 are disposed again peripherally of rotary shaft 11, andthen the same steps as described above are repeated.

In the wire structure obtained in this way, since the wire is alignedaccurately and three-dimensionally at prescribed pitches, a member thatcan conduct electricity only in one direction such as an anisotropicconductive material may be manufactured by embedding the wire structureinto rubber or a resin and then cutting the structure into pieces of anappropriate size.

The second method of alignment and an apparatus therefore will now bedescribed.

FIG. 5 is a schematic block diagram illustrating one embodiment of themethod for three-dimensional wire alignment (second method of alignment)and the apparatus for three-dimensional wire alignment (first apparatusof alignment) for implementing the same.

In FIG. 5, reference numeral 20 represents an apparatus forthree-dimensional wire alignment. A prism space 21 is defined by twoside plates 22 and 23 that face one another, disposed in a directionperpendicular to the axis of prism space 21, and two separator plates 24and 25 having a prescribed thickness are disposed on one side of prismspace 21 parallel with and spaced a prescribed distance from the axis ofprism space 21.

The apparatus is constructed in such a manner that side plates 22, 23and separator plates 24, 25 are rotated peripherally of the axis ofprism space 21 via a driving means such as a motor, which is not shownhere. On the side of the outer periphery of separator plates 24, 25,wire 28 is fed from wire bobbin 26 through guide 27 at prescribedpitches. Reference numeral 29 represents an axis of prism space 21.

FIG. 6 shows a preferred example of separator plates 24, 25, which areprovided with V-shaped grooves 30 formed on end surfaces of separatorplates 24 and 25, at prescribed pitches. This arrangement is preferablebecause the wire may be aligned accurately.

In the apparatus for three-dimensional wire alignment 20 having such astructure, two separator plates 24 and 25, each having a prescribedthickness, are disposed a prescribed distance apart from one another,such that prism space 21 is defined therbetween and prism space 21 isrotated about central axis 29 many turns.

As described above, by rotating prism space 21, that is, by rotatingside plates 22, 23 and separator plates 24, 25 about central axis 29many turns, a wire 28 is wound on two separator plates 24, 25 atprescribed pitches so that wire 28 is aligned over the surfaces thereof.Then, steps of staking another two separator plates on these twoseparator plates 24, 25, and winding a wire thereon at prescribedpitches again are repeated prescribed times.

In this way, a wire structure 17 (shown in FIG. 4) is obtained whereinthe wire is wound at prescribed pitches accurately andthree-dimensionally.

After the steps of manufacturing the wire structure, the wire outsideseparator plates 24, 25 is cut to remove the wire structure, and twoadditional separator plates are disposed a prescribed distance apart todefine prism space 21 therebetween, and then the steps described aboveare repeated.

In the embodiment shown in FIG. 5, though one piece of the wirestructure is manufactured, it is also possible to manufacture two piecesof wire structures using separator plates 24 and 25, which have prismspace 21 defined therebetween. As described above, separator plates 24and 25 face one another and are perpendicular to central axis 29.

Though the third method of alignment is not described in detail, wirestructure 17 having wire 28 aligned at prescribed pitches accurately andthree-dimensionally (as shown in FIG. 4) is also obtained by a methodwherein a mold is fixed and a wire bobbin is moved, which is a reversalof the first and second methods of alignment discussed above, comprisingthe steps of, for example, in FIG. 5, building a mold using side surfaceplates 22, 23 and separator plates 24, 25, which define prism space 21,and moving a wire bobbin 26 and a guide 27 around the mold.

An embodiment of an apparatus for three-dimensional wire alignment(second apparatus of alignment) will now be described.

FIG. 7 is an explanatory drawing illustrating a second apparatus ofalignment for three-dimensional wire alignment. (Hereinafter referred toas “apparatus of alignment”). The apparatus of alignment 1 comprises amain body 1A for manufacturing a wire structure, and a wire feedingmechanism 1B for feeding wire 2 to main body 1A. Of course, it may beformed as an integrated apparatus. FIG. 7 is accompanied by an enlargedcross sectional view of mainly guide block 5 to be stacked in main body1A.

The plan view of wire feeding mechanism 1B of FIG. 7 viewed from the topof FIG. 7 is shown in FIG. 8. The wire feeding mechanism 1B comprises awire bobbin 3 on which a wire is wound, a torque motor 31 for applying atensile strength to wire 2, and a pulley 33 for feeding the wire fromthe prescribed position to main body 1A, and all these elements aredisposed on the same base 41. The base 41 has, as shown in FIG. 7, twostages in the vertical direction, and wire 2 wound on bobbin 3 disposedon lower base 41 is fed through hole portion 51, formed on the upperbase as shown in FIG. 8, to main body 1A via a pulley disposed in a rowon upper base 41 at the prescribed location.

As shown in FIG. 7 and 8, base 41 comprising 2 stages is disposed onsliding mechanism 71 provided on the upper surface of supporting base61. The sliding mechanism 71 allows base 41 to slide at prescribedpitches in a direction perpendicular to the wire feeding direction shownin FIG. 8, which is illustrated by the arrow M. The pulleys 33 disposedin a row are fixed at prescribed positions, and preferably the distancebetween each pulley 33 is set at an integral multiple of the pitch ofgrooves 37 formed on spacer 4, which will be described later, accordingto the disposing pitch of the wire in the wire structure to bemanufactured.

On the other hand, main body 1A comprises a spacer 4 and a guide block 5for straining wire 2, a mold 6 for mounting guide block 5, and a rotarymechanism 7 for rotating mold 6.

FIG. 9 shows an explanatory drawing of the structure of mold 6 used inthe apparatus of alignment 1 shown in FIG. 7 in detail.

FIG. 9 shows that mold 6 has an H-shaped cross section, and includes amounting hole 42 for inserting rotary shaft 8 of rotary mechanism 7 inthe center thereof. The mold 6 also includes side walls 62, each formedwith positioning groove 52 for stacking spacer 4 at prescribedpositions, and comprises two recess portions 82A and 82B defined by sidewalls 62 and bottom surface portion 72 having a mounting hole 42 formedthereon. The guide block 5 is secured to side walls 62 and/or the bottomsurface portion 72 on the outside thereof by means of screws or thelike.

The mold 6 has, assuming that mounting hole 42 is a central axisthereof, a configuration symmetry about the central axis, and the wirestructure is formed in each recess portion 82A and 82B. Such recessportions formed on the mold used for the apparatus of alignment of thepresent invention are not limited to being formed at two positions, butmay be formed at one position or three positions, for example. Whenusing mold 6 having a plurality of recess portions, the length of thewire extending from one wire structure to another structure may bereduced so as to reduce the waste of wire.

By using rotary mechanism 7, when mold 6 is rotated in a prescribeddirection, for example, clockwise as shown in FIG. 7, wire 2 is strainedat a constant tensile strength through guide block 5 disposed on theupper right side first, then spacer 4 on the upper right side, andspacer 4 on the upper left side, then guide block 5 on the upper leftside of main body 1A. The lower recess portion 82B of mold 6 then movesto the upper side thereof, wire 2 is tightened in recess portion 82B asin recess portion 82A. In this way, by performing the installation ofspacer 4 and guide block 5 while suspending the revolutioninstantaneously during revolution of mold 6 by approximately aprescribed angle, a wire structure having a wire 2 strained atprescribed intervals may be obtained.

The detail structure and the method of straining wire 2 will be nowdescribed.

The guide block 5 and spacer 4 are mounted on mold 6 for the first stage(the lowest stage). The tip of wire 2 drawn from wire feeding mechanism1B is fixed at a prescribed position by the use of the side surface ofbottom surface portion 72 of mold 6 or the like, for example, at fixingpoint 92 shown in FIG. 9 by the use of a screw or other various means.

The mold 6 is rotated by approximately a prescribed angle to strain wire2 to guide block 5 disposed on the side of fixed point 92 on one ofrecess portion 82A so that wire 2 is received in notched portion 35formed on guide block 5. In the case where wire feeding mechanism 1Bshown in FIG. 7 and FIG. 8, eight parallel portions of wire 2 arestrained at prescribed distances simultaneously.

Explanatory drawings illustrating one embodiment of guide block 5 areshown in FIG. 10(a), (b), (c), and (d). FIG. 10(a) is a rear elevation,FIG. 10(b) is a plan view, FIG. 10(c) is a front view and an enlargedview of a notched portion 35, and FIG. 10(d) is a crow-sectional view,and guide block 5 is formed with notches 35 on the edge of a side 53thereof at prescribed pitches. The wire is hooked on notch 35, and byfurther rotating mold 6, it is guided to groove portion 37 of spacer 4so that wire 2 is received between notched portion 35 and groove portion37.

FIG. 11 is a perspective view illustrating one embodiment of thestructure of spacer 4. On the upper surface of spacer 4, groove portion37 is formed at the same disposing pitches as that of notched portion 35on guide block 5 along the direction in which the wire is strained. Bystraining the wire so as to be received in groove portion 37, theintervals between the portions of wire 2 strained on the upper surfaceof spacer 4 become constant so that the accuracy of the strainingposition of wire 2 is ensured.

As described later, since spacers 4 are stacked one one another,defining the depth of groove portion 37 larger than the diameter of wire2 allows the upper and lower surfaces of spacers 4 to be in directcontact with one another when stacked, as shown in FIG. 13. In this way,the disposing pitch of wire 2 in the direction of stacking of spacer 4is aligned correctly so that the straining accuracy of the wire isimproved.

In order to maintain the straining accuracy of wire 2, accurateformation of groove portion 37 is required. As a method of forminggroove portion 37, preferably, a chemical method such as chemicaletching or the like, or a mechanical process such as dicing is used.

The wire 2 is received in groove portion 37, so as to be received inparallel, formed on another spacer 4 disposed in recess portion 82A,which allows the wire to be strained between spacers 4. In addition,wire 2 is guided to notched portion 35 formed on another guide block 5disposed in recess portion 82A, and strained between another spacer andanother guide block 5. The first wiring operation between guide blocks 5in recess portion 82A is completed in this way. Then, mold 6 is rotated,wire 2 is strained between guide blocks 5 to complete the first wiringoperation in recess portions 82A and 82B.

As described above, it is preferable that the intervals between wires 2to be fed is an integral multiple of the disposing pitch of grooveportion 37 formed on spacer 4 (the same disposing pitch as that ofnotches 35 formed on guide block 5) in wire feeding mechanism 1B.Therefore, when the disposing pitch of groove portion 37 and the spacingbetween pulleys are the same, the wire structure may be obtained byrotating mold 6 while disposing spacer 4 and guide block 5 adequatelywithout sliding mechanism 71 of wire feeding mechanism 1B.

On the other hand, when the spacing between pulleys 33 is equal to ormore than two times the disposing pitch of groove portion 37, the wirefeeding position is adjusted by sliding base 41 by a disposing pitch ofgroove portion 37 after the wire is strained in recess portion 82Bbefore wire 2 is strained in recess portion 82A again by the use ofsliding mechanism 71 in wire supplying mechanism 1B so that the wire isguided to notched portion 35 and groove portion 37 adjacent to thenotched portion and the groove portion where the wire is alreadystrained.

After adjustment of the wire feeding position is performed, anothereight parallel wires 2, which are parallel to eight wires 2 previouslystrained by rotating mold 6 one turn, are strained. Steps of adjustingthe wire feeding position by sliding mechanism 71 and rotating mold 6are repeated until all groove portions 37 formed on one spacer 4 arefilled with wires 4. It is needless to say that, when such a slidingmechanism 71 is used, setting the first feeding position of wire 2 sothat all groove portions 37 formed on one spacer 4 are filled with wires2 is required.

After all grooves 37 of spacer 4 on the first stage are applied withwire 2, the second stage of spacer 4 is disposed. By moving slidingmechanism 71 in the opposite direction in which the wire is applied onthe space of the first stage, the wire application on spacer 4 on thesecond stage is performed. In this way, steps of disposing spacer 4,adjusting the wire feeding position by sliding mechanism 71, androtating mold 6 are repeated until a prescribed number of stages may beobtained.

The guide blocks 5 are required to be stacked corresponding to thestacking of spacers 4. Here, only one guide block 5 may be used formultiple stages of guide blocks 4. In other words, as shown in anexplanatory drawing of FIG. 12, in spacers 4 stacked to a prescribednumber of stages, it is possible to strain wire 2 between a plurality ofgroove portions 37 positioned on imaginary lines extending almoststraightly parallel to the direction of stacking and a notched portion35 formed on one guide block 5. In this way, by reducing the number ofguide blocks 5 to be used, the cost for components may be reduced andthe manufacturing operation of the wire structure may be simplified.

Of course, notch 35 must have sufficient depth and width to receive allwires 2, since a plurality of wires 2 are to be received therein.Previously described enlarged view of notched portion 35 of FIG. 10(c)illustrates the state where twenty-four pieces of wires 2 are receivedin notched portion 35. In other words, one guide block (single stage) 5is used for spacers 4 stacked into twenty-four stages.

In this way, when a single stage of guide block 5 is used for multiplestages of spacers 4, as shown in FIG. 7 and FIG. 12, wires 2 present thestate of spreading out at constant angles toward the stacking directionof spacers 4. Since a subsequent guide block 5 is disposed on the guideblock 5 discussed above, if the subsequent guide block 5 comes intocontact with previously strained wire 2 or causes wire 2 to be bent, thetensile force of wire 2 may vary, or wire 2 may be damaged or broken.

Therefore, according to the present invention, it is preferred to form abevel portion on guide block 5 corresponding to the straining angle ofwire 2 so that the wire strained to spacer 4 comes into contact withonly notched portions 35 of guide block 5. As shown in an enlarged viewof FIG. 7 and a cross-sectional view of FIG. 10(d), bevel portion 53 isformed on the lower surface of guide block 5.

In the case of the apparatus of alignment 1 shown in FIG. 7, wire 2 isapplied to be bent at notched portion 35 at an angle of about 90degrees. In this case, if the contour of the bottom portion of thenotched portion has a sharp edge, wire 2 tends to be bent and broken atthat edge portion. Therefore, as shown in FIG. 10(d), it is preferablethat the bottom portion of notched portion 35 is formed in a profilehaving a plurality of obtuse angles combined or a curvature so that wire2 is not bent excessively.

When stacking guide blocks 5 corresponding to the stacking of spacers 4,if notched portion 35 is positioned on an imaginary line parallel to thestacking direction of guide blocks 5 (the same direction as the stackingdirection of spacers 4), wires 2 applied in recess portion 82A and 82Bare overlapped on one another on the side surface of already disposedguide block 5.

In such a case, since wires 2 have a tendency not to run straight, theremay occur problems such that the tensile force of wires 2 may slightlyvary, or that wires may form a kink due to contact between wires 2 whichmay lead to breakage thereof. In addition, it may cause another problemsuch that, after manufacturing of the wire structure is complete, it mayrequire much time and expense in cutting wires 2 when taking the wirestructure out of mold 6.

In order to solve the problems described above, as shown in an enlargedview of FIG. 7, it is preferable to define the configuration and/or thestacking position of guide block 5 in such a manner that the distancebetween spacer 4 and notched portion 35 formed on guide block 5 becomeslarger as the number of stacked guide blocks 5 increases.

This ensures that wire 2 is received in notched portion 35 and wires 2are disposed approximately in parallel without overlapping one anotherbetween recess portion 82A and 82B, so that the straining accuracy ofwire 2 is ensured and the cutting operation of wire 2 after the wirestructure is manufactured may be facilitated.

Preferably the structure of guide block 5 is such that it is screwed toside wall 62 or the like of the previously mounted guide block 5 and/ormold 6 by the use of screw hole 55 or the like shown in FIGS. 10 (a) to(d) as it is stacked one after another so that the position thereof isfixed.

By using guide block 5 described above, wire 2 is prevented from beingbent extremely at the edge portion of spacer 4, and thus the pressureapplied by wires 2 is distributed without being concentrated in the edgeportion so that spacer 4 may be kept free from deformation. This enablesthe stacking of multiple layers and the straining accuracy of wires 2between spacers 4 is preferably maintained.

As described above, when steps of rotating mold 6, operating slidingmechanism 71, and stacking a prescribed number of spacers 4 and guideblocks 5 are performed in a prescribed order to obtain the straining ofwire 2, the wire is cut off with the tensile strength kept constant.Maintaining the tensile strength of wire 2 may be achieved by forming afixing point, for example, that is similar to fixing point 92 formed onmold 6, on guide block 5 disposed on the uppermost stage.

As a next step, as described above, after the wire structure is obtainedby the use of the first to the third methods of three dimensional wirealignment or the first or the second apparatus of alignment, aninsulating material such as rubber, plastic or plastic-ceramiccomposites is poured into the wire structure and cured.

Pouring of an insulating material into the wire structure is generallycarried out by placing the wire structure into the mold and introducingthe insulating material into the mold in a melted state. Preferably,pouring operation is carried out by a vacuum casting method.

Then, after the insulating material is cured and the frame body, theseparator plate and the guide block and so on are removed, a compositeblock body 38 (shown in FIG. 14) having wires 34 disposed therein atprescribed pitches may be obtained.

In FIG. 14, composite block body 38 comprises an insulating materialsuch as rubber, plastic, or a plastic-ceramic composites 32 havingconductive wires 34 disposed at prescribed pitches.

The wires 34 are disposed in such a manner that they extend linearlyfrom a surface 36 of composite block body 38 to an opposed surface 39,and project from surface 36 and opposed surface 39.

When such a composite block body 38 is obtained, composite block body 38is sliced (cut) along surfaces A1, A2, which are perpendicular to wires34 by means of a band saw, wire saw, or the like so that a conductivematerial such as a printed circuit board material or an anisotropicmaterial may be obtained.

According to the method described above, since wires 34 may be arrangedat prescribed intervals accurately in dimension, a printed circuit boardmaterial with wires 34 arranged at narrower pitches (high density), forexample, at pitches of 1.27 mm or below may be obtained, and moreover,the crosstalk associated with narrower pitches may be minimized.

FIG. 15 illustrates an example of a printed circuit board materialmanufactured according to the present invention. In FIG. 15, boardmaterial 40 is composed of plastic and ceramic, and comprises aninsulating material 43 formed in the shape of a plate and wires 44disposed therein at prescribed pitches. The ends of wires 44 areprojecting from both sides of insulating material 43 so that both sidesof board material 40 are electrically conducted.

The board material 40 having such a structure may be formed into aprinted circuit board, for example as shown in FIG. 16, with aconductive layer (photo process layer) 45 having a prescribed circuitthereon, and a group of connection terminals 46 disposed on both sides.

The material used for conductive material will now be described.

In the present invention, a printed circuit board material or ananisotropic conductive material may be used as a conductive material.The constituting material may be any material such as rubber, plastic,glass, ceramic, etc., as far as it is an insulating material.

In the case where the conductive material is a printed circuit boardmaterial, an insulating material constituting the board material ispreferably composed of plastic and ceramic, and is constructed in such amanner that ceramic particles, ceramic fibers or the like are dispersedinto the matrix of plastic.

While the compounding quantity of both components may be selectedadequately according to the characteristics such as an insulatingproperty, low heat expansibility, abrasion resistance, and so on or theobjectives thereof, it is preferable to contain from 40 volume % to 90volume % of ceramic particles, ceramic fibers or the like consideringthat low heat expansibility and volumetric shrinkage due to hardening issmall within this range.

In the insulating material of the present invention, since thevolumetric shrinkage due to hardening may be 1% or less, or further 0.5%or less, it is quite advantageous for improvement of the dimensionalaccuracy of the wire in the board material.

By adjusting the compounding quantity in the range described above, lowheat expansibility and abrasion resistance may be added effectively tothe insulating material. If the content of ceramic particles or ceramicfibers exceeds 90 volume %, the content of plastic is insufficient whichmay result in loss of flow property during molding operation.

Ceramic includes glass such as quartz glass as well as alumina,zirconia, and nitriding silicon. Ceramic is mixed in the state ofparticles or fibers.

As plastic, any of thermoplastic resin and thermosetting resin may beused. Thermoplastic resin includes various resins such as vinylchloride, polyethylene, polypropylene, polycarbonate, liquid quartzpolymer, polyamide, polyimide or combination of two or more thereof.

On the other hand, as a thermosetting resin, phenol resin, epoxy resin,urea resin, or combination of two or more thereof may be used.

Preferably, the insulating material used for the board materialdescribed above is formed by mixing ceramics such as glass chipsobtained by cutting glass fibers into a prescribed length or glass beadsinto plastic such as an epoxy resin or the like, since it has noanisotropy in thermal expansion and superior in insulating property, lowheat expansibility, abrasion resistance, and strength.

As a material used for the wire to be disposed in the insulatingmaterial at prescribed pitches, any kind of metal having conductivitymay be used. However, it is preferable to be any one of copper, copperalloy, aluminum, or aluminum alloy. In addition, considering abrasionresistance, flexibility, oxidation resistance, and strength, the wire ispreferably made of beryllium copper. Industrial Applicability

According to the method of three-dimensional wire alignment and theapparatus therefor, a wire structure having wires alignedthree-dimensionally and accurately at prescribed pitches may beobtained. Since disposition of a guide block reduces the pressureapplied to the spacer, deformation of the spacer may be prevented andmulti-layer stacking and upsizing of the spacer may be performed easily.Since positioning of the spacer in the mold is facilitated and thespacer is provided with groove portions for receiving wires, theaccuracy of wire positioning may be easily ensured. In addition, controlof the wire feeding position by means of sliding mechanism, employmentof a guide block, and control of the position of guide blocks enables amore efficient process for manufacturing wire structures whilemaintaining a tensile strength of the wire constant. As a result, alarge sized wire structure with high dimensional accuracy may bemanufactured with improved productivity. By using this wire structure, aprinted circuit board material or an anisotropic conductive material maybe manufactured.

What is claimed is:
 1. A method of three-dimensional wire alignment for manufacturing a wire structure including wires aligned three-dimensionally at prescribed pitches, comprising the steps of: providing at least one frame body having a prescribed thickness and having a central axis arranged radially perpendicular to a rotation axis of a rotary shaft; winding a wire on said at least one frame body at prescribed pitches by rotating said rotary shaft about said rotation axis, wherein said wire contacts at least one surface of said at least one frame body; and stacking another frame body on said at least one frame body and winding a wire thereon at prescribed pitches to form a wire structure.
 2. A method of three-dimensional wire alignment for manufacturing a wire structure including wires aligned three-dimensionally at prescribed pitches, comprising the steps of: disposing two separator plates, each having a prescribed thickness, at positions parallel to and spaced from one another and parallel to and spaced from a rotation axis of a rotary shaft; winding a wire on said two separator plates at a prescribed pitch by rotating said rotary shaft about said rotation axis; and stacking subsequent sets of separator plates on said two separator plates and winding a wire thereon at prescribed pitches to form a wire structure.
 3. The method of three-dimensional wire alignment at set forth in claim 2, wherein at least one surface of each of said two separator plates has V-shaped grooves formed at prescribed pitches.
 4. An apparatus for three-dimensional wire alignment, comprising: a rotary shaft; two side plates spaced apart and facing one another disposed along a direction perpendicular to a rotation axis of said rotary shaft; two separator plates, each having a prescribed thickness, disposed at positions parallel to and spaced from one another and parallel to and spaced from said rotation axis; driving means for rotating said two side plates and said two separator plates about said rotation axis; and a wire bobbin for feeding a wire to be wound from the outside of said two separator plates at prescribed pitches.
 5. The apparatus for three-dimensional wire alignment as set forth in claim 4, wherein at least one end surface of each of said two separator plates has V-shaped grooves formed at prescribed pitches.
 6. An apparatus for three-dimensional wire alignment, comprising: a wire feeding mechanism; a spacer; a guide block for straining a wire; a mold for mounting said spacer and said guide block; and a rotary mechanism for rotating said mold, wherein said spacer has groove portions formed therein at prescribed pitches and depths for arranging said wire on said spacer at prescribed pitches, and said guide block has notched portions formed therein at prescribed pitches for defining a straining position of the wire and supporting the tensile strength of the wire.
 7. The apparatus for three-dimensional wire alignment as set forth in claim 6, wherein a distance between said spacers and said notched portions on said guide blocks increases as said spacers and said guide blocks are subsequently stacked.
 8. The apparatus for three-dimensional wire alignment as set forth in claim 6, wherein said groove portions on each of a plurality of said spacers are substantially aligned with one another in a stacking direction of said spacers and said guide blocks stacked in multiple layers.
 9. The apparatus for three-dimensional wire alignment as set forth in claim 6, wherein said notches on said guide blocks are provided with beveled portions corresponding to the straining angle of the wires for allowing the wires to only contact said notched portions of said guide blocks.
 10. The apparatus for three-dimensional wire alignment as set forth in claim 6, wherein a bottom portion of each of said notches on said guide blocks has a profile having an obtuse angle or a curvature.
 11. The apparatus for three-dimensional wire alignment as set forth in claim 6, wherein said wire feeding mechanism controls wire feeding positions by sliding in a direction parallel to a rotary shaft of said rotary mechanism and said mold.
 12. The apparatus for three-dimensional wire alignment as set forth in claim 6, wherein said mold has a symmetric structure about a rotary shaft of said rotary mechanism.
 13. A method for manufacturing a wire structure wherein said wire is strained three-dimensionally at prescribed pitches between grooved portions of a spacer and at pitches of the thickness of said spacer comprising the steps of: (a) using a wire feeding mechanism, said spacer provided with said grooves for straining the wire by arranging it at prescribed pitches and at prescribed depths, a guide block provided with notched portions for defining a straining position of the wire and supporting the tensile strength of the wire formed at prescribed pitches, a mold for mounting said spacer and said guide block and a rotary mechanism for rotating said mold; (b) rotating said mold while adjusting the feeding position of the wire from said wire feeding mechanism so that the wire is received in said prescribed notched portions on said guide blocks and said groove portions on said spacers; (c) stacking said spacers and said guide blocks on said mold while suspending rotation of said mold instantaneously; and continuing steps (a)-(c) to form a wire structure.
 14. The method of manufacturing a wire structure as set forth in claim 13, wherein said guide block is fixed to a side wall of at least one of a previously mounted guide block or mold.
 15. The method of claim 13, further comprising the steps of: pouring an insulating material into the wire structure; curing said insulating material; and slicing said cured insulating material transversely of the wire.
 16. The method for manufacturing a conductive material as set forth in claim 15, wherein said insulating material is selected from the group consisting of rubber, plastic, and plastic-ceramic composites.
 17. A method of manufacturing a conductive material comprising the steps of: providing at least one frame body having a prescribed thickness and having a central axis arranged radially perpendicular to a rotation axis of a rotary shaft; winding a wire on said frame body at prescribed pitches by rotating said rotary shaft about said rotation axis, wherein said wire contacts at least one surface of said frame body; stacking another frame body on said at least one frame body and winding a wire thereon at prescribed pitches to form a wire structure; pouring an insulating material into the wire structure; curing said insulating material; and slicing said cured insulating material transversely of the wire.
 18. The method for manufacturing a conductive material as set forth in claim 17, wherein said insulating material is selected from the group consisting of rubber, plastic, and plastic-ceramic composites.
 19. A method for manufacturing a conductive material comprising the steps of: disposing two separator plates, each having a prescribed thickness, at positions parallel to and spaced from one another and parallel to and spaced from a rotation axis of a rotary shaft; winding a wire on said two separator plates at a prescribed pitch by rotating said rotary shaft about said rotation axis; stacking subsequent sets of separator plates on said two separator plates and winding a wire thereon at prescribed pitches to form a wire structure; pouring an insulating material into the wire structure; curing said insulating material; and slicing said cured insulating material transversely of the wire.
 20. The method for manufacturing a conductive material as set forth in claim 19, wherein said insulating material is selected from the group consisting of rubber, plastic, and plastic-ceramic composites. 